Description

Key Responsibilities:

·        New Product Introduction (NPI) & R&D Transfer to production.

·        Manage a team of ~10 engineers across Israel, China, US.

·        Manage transition of hardware products from R&D to mass production, including documentation, HW readiness, SW readiness, test readiness, and supplier onboarding.

·        Lead DFM reviews and feedback loops to improve product manufacturability and testability.

·        Establish and own end-to-end NPI processes with engineering ownership throughout the lifecycle.

·        Maintain product BOMs, AVL, and configuration control using PLM tools (Agile PLM Knowledge, Agile Admin advantage).

·        Manage engineering change control (ECO/MCO/DCO/Deviation Approvals and implementation).

·        Lead component selection and collaborate with R&D for compliant, available, and cost-efficient parts.

·        Maintain engineering documentation including schematics, mechanical drawings, packing/labeling orders and test procedures.

·        Support quality incidents processes including CAPA, 8D, and root cause analysis (RCA).

·        Knowledge in test types like JTAG, FT and repair workflows.

·        Manage RMA team, maintain continuous improvement of product reliability.

·        Experience in troubleshoot manufacturing issues and lead root-cause investigations.

·        Optimize yield, test coverage, optimize durations and processes robustness across production sites.

·        Collaborate with R&D, product management, quality, logistics, service logistics and field support teams.

·        Mentor and develop engineering HR.

·        Drive process automation and efficiency improvements, including use of AI and digital tools.

Requirements

·        B.Sc. in Electrical/Electronics Engineering or related field.

·        10+ years of experience in NPI, product engineering, or hardware lifecycle roles.

·        Proven leadership of engineering teams and global manufacturing partners.

·        Deep knowledge of electronics manufacturing (PCBA, SMT, final assembly).

·        Hands-on experience with PLM systems, component engineering, and test development.

·        Fluent in English (written and spoken), strong communication and interpersonal skills.

·        Experience with audio/telecom systems or ruggedized industrial hardware.

·        Familiarity with environmental and compliance standards (RoHS, REACH, WEEE, ISO-14001, etc).

·        Background in integrating AI/automation tools into engineering processes.

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